The Fast Level Set Technique, developed by John Tsitsiklis and John Helmsen, is shown in the context of one of its original applications. Photolithography and plasma etch pattern transfer in 2 and 3 dimensions are important simulation problems in semiconductor manufacturing. Fast level sets are particularly suited to photolithography simulation, since most models have etch rates that can be defined only in terms of position. Recent research has demonstrated that extensions can be made to the fast level set method that show some promise to extensions to more complex problems such as plasma etch.
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